VUE 400-P NexGen

Semiconductor & Electronics Failure Analysis, Reliability Counterfeit detection, voids, disbonds, die-attach, cracks, delamination

OKOS Digital Imaging System (ODIS)

VUE 400-P imaging power surpasses modern standards delivering premium FA Lab features to semiconductor fabrication facilities. ODIS is the latest Acoustic Microscopy software with rich technical content built on current platforms and industry feedback. Advanced analysis is provided through quantitative tools for measurement and classification of parts.
The Analysis version of ODIS allows non-scanning computers to virtually scan, view, and analyze data for simultaneous real-time analysis or post collection

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01 / Features

Scan Area
380 mm x 360 mm
Two JEDEC Trays

Inspection
Pulse Echo | Through Transmission
Simultaneous 2 JEDEC Trays C-Scan PE
Simultaneous 1 JEDEC Tray C=Scan PE|TT

Transducers
1 MHz to 230 MHz

Instrumentation
Up to 500 MHz Pulser-Receiver
Up to 12 GHz Sampling Rate
8 to 12 bits Dynamic Range

02 / Construction

Performance
Max Velocity 1.5 m/s on Scan Axis
0.5 micron encoder scan resolution

Accessories
Integrated Water Management

Form Factor
Stainless Steel Tank
HD LED Lighting
Tray Fixture
Wafer Fixture

Dimensions
885 mm/34.84" (left to right)
816 mm / 32/12" (front to back)
Net Weight 250 Kg

03 / Software

Inspection & Analysis
Multi Zone Inspection (SALI)
C-Scans, B-Scans, A-Scan
Peak Amplitude & Time of Flight
Defect Detection
Thickness Measurement
Cluster Analysis
Histogram
Void Analysis
Quantification
Go/No-Go Classification

User Interface
Modes: Advanced | Engineer | Operator

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PVA TePla OKOS
7036 Tech Cir, Manassas
Virginia 20109
UNITED STATES

Phone: 1 703.880.3039

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