VUE 250-P NexGen
Semiconductor & Electronics Failure Analysis, Reliability Counterfeit detection, voids, disbonds, die-attach, cracks, delamination
OKOS Digital Imaging System (ODIS)
VUE 250-P imaging power surpasses modern standards delivering premium FA Lab features to semiconductor fabrication facilities. ODIS is the latest Acoustic Microscopy software with rich technical content built on current platforms and industry feedback. Advanced analysis is provided through quantitative tools for measurement and classification of parts.
The Analysis version of ODIS allows non-scanning computers to virtually scan, view, and analyze data for simultaneous real-time analysis or post collection review
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01 / Features
Scan Area
322 mm x 136 mm
Single JEDEC Trays
Inspection
Pulse Echo | Through Transmission
Transducers
1 MHz to 150 MHz
Instrumentation
Up to 300 MHz Pulser-Receiver
Up to 4 GHz Sampling Rate
8 bits Dynamic Range
02 / Construction
Performance
Max Velocity 500 mm/s on Scan Axis
5-micron encoder scan resolution
Form Factor
Stainless Steel Tank
HD LED Lighting
Tray Fixture
Dimensions
700 mm (left to right)
560 mm / (front to back)
Net Weight 81 Kg
03 / Software
Inspection & Analysis
Multi Zone Inspection (SALI)
C-Scans, B-Scans, A-Scan
Peak Amplitude & Time of Flight
Defect Detection
Thickness Measurement
Cluster Analysis
Histogram
Void Analysis
Quantification
Go/No-Go Classification
User Interface
Modes: Advanced | Engineer | Operator