MACROVUE-P NexGen
Semiconductor & Electronics Failure Analysis, Reliability Counterfeit detection, voids, disbonds, die-attach, cracks, delamination
OKOS Digital Imaging System (ODIS)
MACROVUE-P imaging power surpasses modern standards delivering premium FA Lab features to semiconductor fabrication facilities. ODIS is the latest Acoustic Microscopy software with rich technical content built on current platforms and industry feedback. Advanced analysis is provided through quantitative tools for measurement and classification of parts.
The Analysis version of ODIS allows non-scanning computers to virtually scan, view, and analyze data for simultaneous real-time analysis or post collection review.
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01 / Features
Scan Area
Up to 2500 mm x 1500 mm
Inspection
Pulse Echo | Through Transmission
Simultaneous 2 JEDEC Trays C-Scan PE
Simultaneous 1 JEDEC Tray C=Scan PE|TT
Transducers
1 MHz to 230 MHz
Instrumentation
Digital Pulser-Receiver
Optional second channel
Up to 12 GHz Digitizer
02 / Construction
Performance
Max Velocity 1.5 m/s on Scan Axis
0.5 micron encoder scan resolution
Accessories
Integrated Water Management
Form Factor
Stainless Steel Tank
HD LED Lighting
Applications
Solar Panels
Large Panels
Custom PCBs
03 / Software
Inspection & Analysis
Multi Zone Inspection (SALI)
C-Scans, B-Scans, A-Scan
Peak Amplitude & Time of Flight
Defect Detection
Thickness Measurement
Cluster Analysis
Histogram
Void Analysis
Quantification
Go/No-Go Classification
User Interface
Modes: Advanced | Engineer | Operator